Electronics Forum | Fri Mar 26 23:07:07 EDT 2010 | dekhead
Just a guess: Are you printing your fiducials on the fiducial side of the board? Fidicial Side is for Vision Calibration, Bare Copper Side is for Offset Calibration (Step 5 of procedure says "copper side uppermost"). After printing 25 fiducials o
Electronics Forum | Fri Apr 06 19:06:38 EDT 2007 | davef
There is no standard for what you're trying to accomplish. We recall a similar thread on SMTnet. In it, a poster suggested: "Call them: 1206T.5, 1206T1.0, SOIC16, RESNET16, SOIC16T5.0, ALCAP4, ALCAP5 etc., where: T means thickness but for the ALCAP
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Wed Aug 25 15:54:46 EDT 2010 | blnorman
I previously did a search on "peel back force" > and there were a few results, and there were a > few hits that say EIA-481 is the standard, but > nothing on what the standard force range is. A > search on "cover tape" yeilds many hits about >
Electronics Forum | Wed Feb 24 12:53:55 EST 1999 | Dave F
| Are the terms "uBGA" and "Fine Pitch BGA" synonomous, different all-together, or is Fine Pitch BGA a subset of uBGA? Thanks. | | Steve | Steve: �BGA�: Micro BGA�. A brand name for a fine pitch BGA from Tessera. Fine Pitch (1) In SMD: Surfa
Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX
| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.
Electronics Forum | Fri Oct 01 07:25:05 EDT 1999 | Wolfgang Busko
| | Hi, | | | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision cente
Electronics Forum | Sat Jun 17 08:57:13 EDT 2000 | Ashok Dhawan
Smtnetters One more question on ESD Control program. Does anyone ground there power equipments and how ? e.g., Pneumatic torque tools , electric screwdrivers, hand soldering stations, solder pots etc. I am not sure about pneumatic hand tools , howev
Electronics Forum | Thu Jul 25 21:41:03 EDT 2002 | davef
1.0 X-OUT POLICY 1.1 Each Panel not to contain in excess of X% X'd-Out boards. 1.2 Each X-Out board to be marked in a manner so that Pick & Place equipment will not attempt to insert those boards X'd-Out such as fiducial reference hole for paneliz
Electronics Forum | Mon Nov 22 11:19:39 EST 2004 | davef
Short answer: Yes. Depending on the application of the conductive ink, suppliers select different mesh for the silver particles. So, you should follow your supplier's recommendations for printing, for instance: Conductive Ink||PI-2000 Highly Condu
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