Electronics Forum | Mon Aug 01 15:54:27 EDT 2022 | tey422
I ran those KE750 & KE760 machines more than 5 years ago. As I recall, it can do some sort of gang pick, just not fully simultaneously. It picks with one head first then, it picks up with the 2nd head with minor delay after the 1st pick.
Electronics Forum | Mon Mar 20 22:08:24 EDT 2023 | tey422
For reflow oven to "auto off" it has to go through the cool down; it should be off went the cool off temperature is reached. Perhaps you need to 1st check if something prevent the oven reach the cool off temp (both hardware & software).
Electronics Forum | Thu Mar 28 16:51:00 EDT 2024 | tey422
Since you only saying it's the hydra error, then only run the hydra calibrations. Sometime the calibration can end up causing more issue if not run it correctly. I would do the hydra camera Z level (1st). If it fixes the issue then you no need to do
Electronics Forum | Fri Jul 07 12:44:49 EDT 2017 | tsauve
The problem is registration between the stencil & the smallest pads on the 5 substrates. Using SPI s/w I can overlay the paste layer over the PCB image to determine stretch/shrink. Our worst case was shrinkage of 10.2mil on a 5-up 300mm panel - small
Electronics Forum | Fri Dec 15 03:35:10 EST 2000 | JohnW
Dave...think you've gone off on one again..., but if you want th secret family recipe for Haggis let me know....actually catch one 1st then I'll tell you how to cook it! Ok so we've got mixed opinion's on the silver then, and mostly based round SMD.
Electronics Forum | Mon May 14 09:24:36 EDT 2001 | rkevin
Can anyone shed some light on this for me ? Subject: Soldering to Immersion Tin surface finish I am looking for info. (pro and con) and/or 1st hand knowledge processing PCB's with Immersion Tin finish through SMT and Wave. Do profiles need to be di
Electronics Forum | Thu Oct 28 04:52:27 EDT 1999 | Paul Gerits
Hi Jerry, normal proces would be; 1st. reflow side (top) 2nd. curring side (bottom) 3rd. insert 4th. solderwave Reason for this is that you have a better handling and no overdue stress to components in case you do bottom before top. It is also eas
Electronics Forum | Tue Oct 13 04:34:53 EDT 1998 | Sanjay Bhatikar
Sir, I have been thinking about your problem. I have a suggestion that may work, although it has not been tried before. How about using two stencils? First print the the whole board with a stencil for 150 micron thickness. Next, place a ste
Electronics Forum | Mon Feb 23 23:50:18 EST 1998 | mike
| Does anyone have any experience with via in pad for | BGAs using conventional thru hole technology? | Steve Joy Steve, I had a customer who had designed a board to use a BGA socket. Well the socket did not work out so we then placed the bga dire
Electronics Forum | Fri Jan 30 14:32:45 EST 1998 | Mike C
| I am just implementing a Statistical Process Control to the SMD. | A few simple questions: | 1. Is it necessary to perform a sampling plan for suppliers inspection? | 2. What are the basical points to control ourself and inspection at a supplier? I
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