Electronics Forum | Thu Nov 05 15:21:42 EST 1998 | Rich Breault
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. Hello Kenny, NETCO Automation has been performing all types of BGA rework including BGA reballing for the last 5 years. We offer 48 hour
Electronics Forum | Fri Jan 04 15:42:03 EST 2002 | nwyatt
There are several implications: - some lead free alloys do not form an acceptable solder joint when used with lead contaning paste. (ie. Bismuth) - if you use both lead free and lead containing components, you will have different solder joint compos
Electronics Forum | Tue Jun 01 19:42:46 EDT 2004 | Ken
The biggest fear is mixing the solder pastes and bar solder. Had a training program for teaching folks what the alloys are and how to read them. I have locked up the bar solder and use the buddy system to restock the pot. Put up many signs on le
Electronics Forum | Tue Oct 11 14:42:15 EDT 2005 | patrickbruneel
NASA website on Tin whiskers: http://nepp.nasa.gov/whisker/ NEMI Tin whisker activities: http://www.inemi.org/cms/projects/ese/tin_whisker_activities.html CALCE Tin Whisker Working Group: http://www.calce.umd.edu/lead-free/tin-whiskers/ Measur
Electronics Forum | Mon Dec 04 21:42:12 EST 2006 | KEN
Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in your evaluation. I have an assembly that we run 10k pieces per month. One two-pin connector has a pitch of 1.27mm. Unfortunately, the pads are 0.007"
Electronics Forum | Thu Jan 12 17:42:55 EST 2012 | warwolf
yeah we are getting quotes on a new solder pot, we have used that paint we tested a small sample of it with solder and it seems to be ok, we are doing a full solder alloy change in about two months so we will have a chance to inspect the solder pot a
Electronics Forum | Fri Mar 20 07:42:44 EDT 2015 | eezday
Dendrite growth is not typically associated with a flux reation but rather is a result of mechanical stress. The stress can be from any source including stress induced by other components, environment, plating or even bimetallics. Dendrites are most
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Tue Aug 01 09:42:07 EDT 2000 | Gary
The Technical Services Group at Alpha Metals has spent a fair amount of time looking at wave soldered Pb-free connections. We too have observed fillet tearing, fillet lifting, and pad lifting. I have concluded that without major changes in the mate
Electronics Forum | Wed Dec 15 16:38:42 EST 2004 | patrickbruneel
Here's my 10 cents Studies done in the 1980's concluded that pure tin was prone to whisker generation. A tin content lower then 70% became exempt from this phenomenon. I have never seen or done any studies on the impact lead had in reducing the pote
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