Electronics Forum | Thu Dec 03 11:01:03 EST 1998 | Walter Cole
Hi Scott, I am a regional manager for Multitroniks and would be glad to assist you with additional information on the systems you are asking about. Both of these machines can be demonstrated for you any time at our factory in Warren, NJ. Below I'l
Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer
| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!
Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea
| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor
Electronics Forum | Fri Jul 25 15:54:22 EDT 2008 | pcbbuilders
I am trying to optimize my reflow profile. i have a 5 zone oven. lead-free: for the 1st 3 zones, i am good, at about 150-200 deg for 150 seconds. during the 4th zone, i am at a temp of 200-220 for 50 seconds. during the 5th zone, i am at 220-245 f
Electronics Forum | Sat Jul 26 07:42:49 EDT 2008 | pcbbuilders
I am not very concerned about production time, but it is always a thought! Quality is more importnant of course. We have 2 different pastes, with almost identical requirements. We can get close to their profiles, but i am worried that i am spending
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Tue Jan 16 07:11:24 EST 2007 | tk380514
I cant touch the pre-heat as it would affect all other products or so i am told by the Qaulity manager. Maybe they think i am Mickey Mouse and the pcb�s jump around the factory like a scene from Fantasia :) if this was only the truth.
Electronics Forum | Wed Jun 04 06:37:10 EDT 2003 | cdowny
I am looking into pick and place for medium to medium-high production with semi frequent changeovers. I have been looking for a little while and nosed around at APEX also. I am not interested in any used products, I have been down that road before
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
