Electronics Forum: apply (Page 9 of 188)

Lead Free BGA in Leaded Board

Electronics Forum | Mon Jul 06 12:01:24 EDT 2020 | mvargas

In case it is another component such as resistors or capacitors, does the same concept apply?

OSP Coating

Electronics Forum | Thu Sep 10 20:46:05 EDT 2020 | SMTA-64387687

Has anyone had experience in applying OSP coating? How difficult is the process? And, what is the equipment used?

Strange reaction with Selective Solder alloy

Electronics Forum | Tue Apr 05 19:29:51 EDT 2022 | proceng1

This flux is used to clean nozzles. It's not applied directly to the board.

Parts Pushing Through Paper Tape

Electronics Forum | Thu Jan 05 11:21:39 EST 2023 | dimamalin

To solve this problem in some situations I use a spacers . This applies to Siemens feeder .

Looking for 'Chipbonder' glue for SMT

Electronics Forum | Thu Oct 26 15:13:16 EDT 2023 | cyber_wolf

Try 3616 or 3609. Both of these become pliable when heat is applied.

Reballing of Plastic BGA

Electronics Forum | Tue Oct 17 18:27:21 EDT 2000 | Philip Reyes

Hello fellows, Can you clear me up regarding the reballing of Plastic BGA? Is it necessary to reball plastic BGA module if you have missing ball defect? What is the alternative process for rework? Do i need to flip the module then apply paste on

Re: Heat Transfer Rates from Quartz Lamps

Electronics Forum | Fri Aug 11 17:21:43 EDT 2000 | Dave F

John: Sorry I'm tardy getting back to you on this Heat capacity = [applied voltage in volts*applied current in amps*(time ending in seconds - time start in seconds)]/(�K ending - �K start) The units of heat capacity are joules per mole-degree when

applying DOE to SMT process

Electronics Forum | Mon Jun 19 21:29:41 EDT 2000 | Jack Hou

Hi, everyone, I'm an new engineer and in charge of SMT process. Now I want to apply DOE to printing process. some questions to ask you guys. 1. how many replications do i need in each run (L8) ? 2. after printing, except solder height, volume, what's

Re: PASTE LEACHING

Electronics Forum | Wed May 03 20:19:31 EDT 2000 | Dave F

Sal: Sorry, sometimes (more often than I�d like to admit) I�m a bit dense. But first � Leaching. Dissolution of a metal coating into liquid solder. Leaching applies to liquid solder and is applied inaccurately to metallurgical effects, like diff

I wonder

Electronics Forum | Wed Sep 08 23:45:19 EDT 1999 | kyung sam park

I wonder to knock this site with this question? Are there some body have applied 6 SIGMA TOOL to improve the smt process or etc. especilly smt process is better. I want to hear the difficulties to apply this tool. and experiences. I dont't care go


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