Electronics Forum: assemble (Page 9 of 600)

Environmental Issues

Electronics Forum | Thu May 21 18:54:36 EDT 1998 | Dave F

Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently tol

DFM-Tool

Electronics Forum | Sun Apr 19 02:31:59 EDT 1998 | JoSi

All, Does anyone know a good book, software, Check list etc. to analyze and develop the whole electronics assembly and manufacturing process ? I mean, not only SMD-process but also unit assembly and final assembly ? I assume that ultimate goal in t

Missing Component at Model Assembly

Electronics Forum | Mon Mar 25 18:34:09 EST 2002 | bayanbaru

What are some of good pratices or poka yoke method that can be implemented to eliminate missing component. At the model assembly operator are required to take different components from the bin boxes and then assemble onto the product. Occasionally, a

BGA underfill necessary with conformal coat?

Electronics Forum | Wed Mar 27 18:23:01 EST 2002 | kmorris

Does anyone have experience doing conformal coating over Plastic BGA in High-Rel PCB assembly? Is underfill necessary to avoid problems with entrapped air, etc? Our application is a 17x17mm BGA, 256 I/O. We are assembling with a water soluable pas

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga

Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as

Walkmen In Assembly Area

Electronics Forum | Thu Jan 09 06:44:38 EST 2003 | ldzaugis

One shop picked up productivity with walkmen. The hand assemblers were jammed in tight and frequently face to face. It cut down conversation significantly and reduced complaints about music in general. The policy was eventually changed to only one he

CSP&flip-chip placement

Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto

Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it

PCB assembly

Electronics Forum | Wed Feb 05 11:10:01 EST 2003 | J. Dumont

Is anyone looking for any PCB assembly work to be done?? We currently build all our boards for our many world class products in house and will possibly be branching into building assemblies for outside companies in the near future. Pricing will be ve

Monitoring Cleanliness of No-clean Assembly

Electronics Forum | Thu Jun 26 17:40:21 EDT 2003 | Steve

Wanted to inquire if anyone has a way to monitor cleanliness of boards that are assembled with a no-clean process. I'm aware that incoming board cleanliness can be monitored, however, I am after checking of cleanliness of boards after assembly. Wit

Silica gel in final packing

Electronics Forum | Tue Jul 01 21:06:12 EDT 2003 | ramanandkini

My customer just assembles it to the car. We want to use the silica gel to avoid moisture since the assembled part (clock) reach him via ship after 50 days. The electronic circuit board has no conformal coatings at present. We are working on that. Ou


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