Full Site - : automatic wafer (Page 9 of 25)

Suss to Introduce Automatic Fusion-bond Cluster at Semicon Europa

Industry News | 2002-04-10 08:40:20.0

Capable of Processing Two Substrates Simultaneously for High Yield in Fabs Producing Micro-mechanical Devices

SUSS MicroTec AG

ScanCOMPONENT PC-based Offline Component Programming System

ScanCOMPONENT PC-based Offline Component Programming System

New Equipment | Software

The ScanCOMPONENT Product helps in creating vision files for your placement machines. It is its own standalone product or a module within the ScanINSPECT VPI product. ScanCOMPONENT is a PC-based offline component programming system for the creatio

ScanCAD International, Inc.

Eclipse Industries

New Equipment |  

Eclipse Industries DS-107 Aligner Bonder The DS-107 Aligner Bonder is an ultra-high precision, high or low force aligner bonder. Constructed on a granite platform for superior stability and rigidity, the DS-107 is designed for alignment accuracy of

Eclipse Industries

Odd form<br><br>� D-9

Odd form

� D-9

New Equipment |  

Odd form is optimized for handling your toughest odd-form challenges, from large through hole connectors to components up to 50 mm tall. Don't settle for anything less than unbeatable accuracy and incredible speed That is what the D-9, Assembl�on's

ProsemTechnology India Pvt Ltd.

Microelectronics Packaging

Microelectronics Packaging

New Equipment | Assembly Services

The Microelectronics Lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing today’s electronics assemblies. Advanced design and modeling software enables STI to

STI Electronics

Cognex Corporation Enters Into $1.3 Million OEM Agreement with Alphasem AG

Industry News | 2002-04-24 08:49:13.0

Alphasem Expects to Purchase Approximately $1.3 Million of Cognex's MVS 8100 Machine Vision Systems Over the Next 18 Months

Cognex Corporation

SHENMAO Debuts F13 Solder Wire for Automatic Soldering Machines

Industry News | 2018-08-21 19:59:23.0

SHENMAO America, Inc. is pleased to introduce its halogen-free F13 solder wire for automatic soldering machines.

Shenmao Technology Inc.

Pyramax - Convection Reflow Oven

Pyramax - Convection Reflow Oven

New Equipment | Reflow

  BTU’s Pyramax™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. Pyramax™ systems provi

BTU International

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Industry News | 2013-06-20 19:31:51.0

Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

Tresky AG

Virtual Industries to Exhibit Advanced Equipment at SEMICON West 2009

Industry News | 2009-06-23 19:29:41.0

COLORADO SPRINGS, CO — May 2009 — Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, announces that it will display several advanced systems in booth 817 at the upcoming SEMICON West exhibition, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Calif.

Virtual Industries, Inc.


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