Electronics Forum: bga and reflow and temperature (Page 9 of 14)

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon

| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea

Re: Cleaning under, around, and through tight spaces

Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.

| | | A question for you all! | | | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we coul

BGA on both Top and Bottom

Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang

Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir

Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 02 10:06:37 EDT 2019 | davef

I don't get it. The liquidus of 80Pb/20Sn is like 280*C. Your reflow temperature got nowhere near that value. Where did that material go? Is it folded back under the component? Disappeared? Was it ever there? Ask someone while analysis tools to hel

OSP finish and Omnix 5002 solder paste(SnPb)

Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz

I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 23 12:33:37 EDT 2019 | ameenullakhan

Hi , Its CCGA part . with normal PCB pad opening similar to other BGA pad . Yes its very surprising and we are not able to analyze. What exactly went wrong. We have new stencil design for this now. Will run it tomorrow. Will update the results.

Required humidity for SMT production and storage

Electronics Forum | Thu Apr 12 13:04:47 EDT 2007 | slthomas

Handling requirements of all classifications of moisture sensitive devices is found in J-STD-033. It really isn't an issue for most parts unless they're going to reach reflow temperature again, which is unlikely unless you're removing a nearby compo

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Dec 11 06:34:24 EST 2019 | ameenullakhan

Hi Everyone, Reducing the top heaters around 10 deg each at last 3 zones of reflow oven. Helped us in achieved little lesser temperature at top connection of the CCGA. And we didn't face any bent. Bridging : Reducing the stencil aperture , has wor


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