Electronics Forum | Wed Dec 24 20:29:45 EST 2008 | xianhua_tang
Oh,I consider the process is wrong,it is stencil print paste-mount-reflow -apply glue-reflow,then wave solder. it must pass twice reflow,also the first reflow profile is different and the second .
Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Thu May 13 20:40:25 EDT 2021 | winston_one
Yes, we can't use pure Pb PROCESS. And as I say we will not use it anyway, as we have lead-free BGA's, LGAs, component with Solder Charged Terminations... It's became almost normal practice to solder it with leaded solder pastes. In this case peak re
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Mon Dec 22 11:09:21 EST 2008 | mfcat
We changed paste manufacturers rather recently and are now seeing SOT23s falling off after wave solder. These parts have a dual process... we stencil print paste, apply glue, populate then reflow. Only SOT23s fall off, chips are fine. We do not be
Electronics Forum | Wed Feb 01 12:20:16 EST 2006 | cvoyles
Hi Bruno, I am an equipment reseller in business since 1994. I have a Smart Sonic MG3000 ultra sonic stencil cleaner in inventory. It is a stainless steel model with Delta Sonics brand ultra sonic generator. It is the guillotine type that raises a
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
