Electronics Forum | Tue Jun 25 16:27:11 EDT 2002 | dason_c
Mark, you can check one of the instruction of the BGA reball process as below. http://www.winslowautomation.com/BGA-Reball-Instruct.pdf
Electronics Forum | Wed Aug 29 09:01:14 EDT 2001 | stefo
Steve, Go to: http://www.sixsigmaservices.com/services.htm They can do it, or you can buy the "solderquik" bga preforms and do it yourself. They have a $50.00 minimum lot charge if you have them do it... -Steve Gregory-
Electronics Forum | Mon Jul 15 17:41:19 EDT 2002 | retronix
We currently provide a full range of BGA re-balling services for several customers in Mexico. Please feel free to check out our web site at wwww.retronixinc.com
Electronics Forum | Mon Apr 20 14:59:14 EDT 2009 | c111
We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource. 1) What percent fallout should I expcet from the re-balling process. 2) After
Electronics Forum | Thu May 13 20:31:06 EDT 2004 | GS
Try contacting Process Sciences in Austin tx at 512-259-7070 They can do that process for you without you having to lay out a ton of $ for equipment
Electronics Forum | Fri May 14 14:08:04 EDT 2004 | bwet
Perhaps you can try to use the new StencilQuik(TM) technque as it more easily facilitates solder balls dropping onto the pads. Info at http://www.solder.net/stencilquik.asp
Electronics Forum | Tue Apr 03 17:00:46 EDT 2007 | Ryan Lee
Hi, I am using winslow reballing kit and instruction , and I have a hard time to get reball success. any one have good information to share. Please Thanks Ryan
Electronics Forum | Wed Apr 04 12:27:59 EDT 2007 | adrian_nishimoto
We reball hundreds of BGAs a week with the RB-2000 kit from Mini Micro Stencil, Inc. The reball stencils are made of stainless steel and can be used over and over again. We have reballed .5mm pitch parts with .012" balls up to 2400 ball BGAs.
Electronics Forum | Thu Oct 26 14:00:18 EDT 2017 | sambolian
Is there a threshold on ball size where we would not need to re-ball a BGA ( i.e. 8 ball / small type packages).
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
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