Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Rework & Repair Equipment
Professional SMD Rework Station for PCBs upto 12"/300mm. The PDR IR-D3Vi Discovery provides all the essential features for quality rework and is made of only the finest materials and components for optimum precision and rework excellence. The PDR IR
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
Industry Directory | Consultant / Service Provider / Manufacturer
Contract Manufacturer for Complex Mix, Medium-Large Volume assemblies with VERY High Yields
This video shows the NEW PDR IR-D3i SMT / BGA Rework station in action! Using PDR's patented Focused IR technology, the D3i & D3Vi Discovery series Rework systems have been specifically designed to cope with the challenges of repairing today's PCB
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
EZReball demonstration video. Simple and Fast new reball method! The new BEST EZReball™ process is an answer to your reballing problems. This unique method simplifies the reballing process allowing for better yields and faster reballing times. http:
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry Directory | Consultant / Service Provider / Manufacturer
QCG, Inc. - Your Printed Circuit Board Design and Assembly support in hard to build technology such as Package on Package (PoP BGA), Dual row QFN / Multi row QFN and fine pitch bump die; all with competitive rates.
New Equipment | Education/Training
Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.
