Parts & Supplies | Circuit Board Assembly Products
CD136 105C Screw electrolytic capacitor CD136 can aluminum electrolytic capacitor, CD136 Screw aluminum electrolytic capacitor, 105C Standard Screw aluminum electrolytic capacitor, Power supply aluminum electrolytic capacitor Manufacture Supply CD1
Parts & Supplies | Assembly Accessories
We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Ple
.jpg)
Parts & Supplies | Assembly Accessories
We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Pl
These Threaded Sealing Caps or Fluid Sealing Caps as they are also known, are made from a high quality LDPE plastic and come with a neoprene rubber disc which is secured within the head of the cap, allowing for a tight full seal that can be easily ti
Industry News | 2011-06-28 15:28:57.0
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new Blue End Caps for Syringe Barrels.
Parts & Supplies | Assembly Accessories
We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Ple
Our High Temperature EPDM Caps are a very strong and resilient product manufactured using a premium form of EPDM Rubber. Able to withstand temperatures of up to 215C° EPDM is commonly employed for a number of uses where exposure to Acids & Al
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Parts & Supplies | Assembly Accessories
We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Ple
.jpg)
Parts & Supplies | Assembly Accessories
We can bring you the following benefits. 1. Save costs 2. MOQ:1 pc 3. You can find the SMT parts you want 4. Fast delivery-- receive the goods in about 7 days 5. Sincere one-to-one professional service 6. Quick response after-sales service Ple
.gif)
