Electronics Forum | Wed Mar 24 23:04:00 EST 1999 | Al O Owzitgon
| We are dealing with down time accredited to the Pumps getting clogged with dried glue. We have decided to purge all spindles at 6 hour intervals. We are looking at making this process automated. Has anybody tried this and if so, is there a way to s
Electronics Forum | Fri May 12 20:15:49 EDT 2000 | M Cox
There are a variety of options without knowing what kind of components are on the bottom side (C's and R's 0805 or 0603 or 0402) you are talking about consider the following Option 1 If bottom side has only Caps, resistors and/or Soic's then... Top s
Electronics Forum | Sat Oct 29 09:10:17 EDT 2005 | davef
You're correct that Room Temperature Vulcanizing (RTV) adhesive is pretty much a cosmetic when it comes to securing components. Beyond that it contains silicone, which produces unsolderable connections in electronics. Further, many RTV seep acidic
Electronics Forum | Tue Nov 27 19:42:58 EST 2001 | mparker
Dave - will placing MELF's in SMT eliminate the original problem? Is the flux aggressive enough to clean mold release agents from the component manufacturer? Good point about LT reliability, just wondering what would happen if glue was eliminated fr
Electronics Forum | Mon Jun 07 14:16:20 EDT 2004 | Rob
I've been approached by my design engineer who would like to know what is the largest component I can place on the secondary side of a double-sided PCB (without adhesive or glue) and not have it fall off when I run the top side. Currently, I can plac
Electronics Forum | Mon Sep 11 07:36:04 EDT 2023 | tommy_magyar
See attached snippet from a datasheet: Syringe 1. Twist and remove the cap from the syringe. Do not discard cap. 2. Measure 1 part by volume of A. 3. Measure 1 part by volume of B. 4. Dispense material on a mixing surface or container, and thoroughl
Electronics Forum | Mon Mar 01 23:57:00 EST 1999 | Erhan Kaya
"DIP, VCD" -> "smt secondary" type of process flow. In that case, dispensing becomes a must. Dispensing needs less setup than printing, but takes longer. So, for a prototype manufacturer, dispensing becomes the best choice. Sometimes a machine dispe
Electronics Forum | Tue Jun 17 09:22:02 EDT 2003 | davef
Higher that recommended is more brittle. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=17906 Q2: Will some of my Ceramic Caps crack during the wave soldering process because of the heat? A2: Probably Q3: Can you see any pos
Electronics Forum | Sat Mar 05 22:32:58 EST 2005 | gpaelmo
Yes we've had problems with kemet caps on 12mm t/r. By the time it gets replaced, our production schedule gets so screwed up. Our immediate solution was to bypass and place them by hand before reflow. We eventually went with a cross from Venkel and i
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
