Electronics Forum | Tue Feb 08 10:24:26 EST 2000 | Clifford Peaslee
Thanks Scott, good suggestion. I will look into it. Cliff
Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Fri Apr 23 16:19:17 EDT 1999 | Todd
We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using a
Electronics Forum | Wed Jul 31 17:39:38 EDT 2002 | dragonslayr
mucho, mucho thanx !!!!!
Electronics Forum | Sat Dec 06 08:49:38 EST 2003 | davef
Start here: http://www.smtnet.com/career_center/
Electronics Forum | Sun Feb 29 07:55:35 EST 2004 | davef
http://www.smtnet.com/career_center/
Electronics Forum | Wed Apr 28 12:17:51 EDT 2004 | mrmaint
Russ, The bridges tend to be on the 2 outside rows. But we have seen a few near the center.
Electronics Forum | Thu Dec 09 16:16:55 EST 2004 | Kevin
Also, they have a demo center Philadelphia, PA and in Torrance, CA.
Electronics Forum | Sat Feb 26 20:44:46 EST 2005 | siverts
Some of the QFN's have/has? (sorry for the grammatics but I live in Sweden) a "ground pad" underneath the center of the body. Some of the manufactories have made a specification of how much solder fillet that needs to be covered on the center pad [f
Electronics Forum | Mon Jun 06 10:15:12 EDT 2005 | davef
Wizy are you using the SMTnet "Career Center" [see the blue bar on the left side of this page]?
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