Electronics Forum | Wed Dec 20 04:43:36 EST 2006 | greg york
Any decent flux would volatise off with the heat of the wave unless absorbed into the solder mask. Test this by trying to clean in alcohol or common solvent aerosol, if it does not clean then it is probably Mineral Salts from solder mask fillers. Ano
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany
Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >
Electronics Forum | Thu Oct 01 13:33:01 EDT 2015 | marlyn
Hey there fellow people with SMT > issues... What's the proper procedure for > soldering through-hole headers on the back-side > of the PCB (pins poking out on same side as SMT > parts)? ( Yes - I did the SMT side first and am > now faced with L
Electronics Forum | Tue Sep 13 10:00:27 EDT 2016 | awhite
Switched out the mech. relay on the board loader, no change. Same behavior. Could not find a mech. relay on the printer... SMEMA wiring appears go directly to a PCB. And it is at that point that I run out of talent. If the machine weren't dedicate
Electronics Forum | Fri Apr 10 10:20:15 EDT 2020 | unisoft
Yes process engineers that work for contract manufacturers try to get the full CAD or XY rotation files from their clients unfortunately still many of their customers still give them only Gerber files for the PCB project. Unisoft has had a focus on
Electronics Forum | Fri Apr 10 10:31:47 EDT 2020 | proceng1
Certain customers do give us CAD. USUALLY ODB++ but I've also gotten .ipc and .pcb . Many of our customers bought or inherited a design, and therefore have no control to generate additional files. Or, as you mentioned, they had another manufacture
Electronics Forum | Thu Mar 31 12:13:28 EDT 2022 | cbart
That is a tough one because of package size I agree, as noted previously it would be good to know what the current PCB pad layout is. first thought does go right to an adapter board of course! is this a volume build or just 20-50 pcs? dead bug and ha
Electronics Forum | Thu Apr 07 19:17:43 EDT 2022 | cbart
Good afternoon The ISI I was mentioning is interconnections solutions which is a division of Molex. a few years back we ran into a component end of life situation but had thousands of very high dollar bare boards in stock. the package was a BGA and w
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
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