Electronics Forum | Mon Apr 04 11:27:07 EDT 2011 | fishingfool
Dback, Most likely shouldn't have color inspection on. Using red light colors will look the same so you gain nothing by using this. What exactly are you getting as false calls? Sounds like you have lots of things going on in this type of inspect
Electronics Forum | Wed Sep 04 13:54:04 EDT 2024 | carl_p
Loved the GC120 but from a price point their insane compared to a panasonic. GC's are excellent chip shooters, ideally need more info & there is naturally a big capacity output between the 2 as the 120 is basically 2 60's... So do you need it? T
Electronics Forum | Thu Jul 06 13:29:42 EDT 2006 | Chunks
Unfortunately it's not what you know, but who you know. Sounds like it in your case. Tread lightly as this guy may become your boss. It happened to me. New guy comes in, couldn't tell the "red stuff" from the "gray stuff" (adhesive / paste in cas
Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.
| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t
Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker
Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te
Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon
| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther
Electronics Forum | Mon Jan 17 14:03:45 EST 2005 | davef
There's a fair amount of information on underfilling CSP and flip chip in the web. Look here to get started: * http://www.asymtek.com/news/articles/2002_globaltronics_csp_and_fcuf.pdf * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID
Electronics Forum | Fri Mar 24 13:25:24 EST 2006 | patrickbruneel
See Samir that's what happens if you go too lead-free seminars, they feed you crap. If they served you lunch with bismuth chips its time you see a doctor or you end up like WML. By the way any takers?? Who in this forum volunteers to be the first to
Electronics Forum | Wed May 24 16:40:40 EDT 2006 | samir
Yikes! Sounds like a hairy situation there. I've successfully collapsed a Pb-Free BGA (using a Sn/Pb solder paste), with a peak temperature of 220 Deg. C and Time Above SAC's Eutetic point (217) of 17 seconds. Beware of overcooking your smaller ma
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