Electronics Forum: component loss (Page 9 of 14)

Pressure check for SMT machine placement.

Electronics Forum | Mon Apr 12 04:56:54 EDT 2004 | qualitel

Hi Eric, Every mounter have a standard count and "release" off the component. The sample and cost saving way is to use the paper (e.g: 4mil,5mil...thick) to measure. Just place on the PCB with supoort base below and release the nozzle step by

Losing parts in reflow

Electronics Forum | Wed Jun 13 14:48:48 EDT 2007 | rgduval

Is there a sort of standard method to prevent part loss in reflow? I've had a couple of situations come up recently where we've lost some parts during second-side processing. We're running an Heller 1800, with a mesh belt. Most items process fine,

PCB moisture content

Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef

We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc

Conformal coating to avoid oil leak from circuit board

Electronics Forum | Sun Nov 10 15:36:06 EST 2013 | davef

Assuming your conformal coating material was selected with the intent of living a life in contact with oil, why doesn't your coating meet the IPC-A-610D requirement of that there be no voiding, no breaks in the surface, no loss of adhesion, etc? Furt

Thru Hole - Manual Soldering

Electronics Forum | Fri Aug 23 13:06:42 EDT 2024 | carl_p

Hello, Currently having some solderability issues with some thru hole soldering of various components. Fuse Holders, LED's, Connectors etc etc... Normally no issues at all. So far i've tried baking the boards, calibration of soldering irons etc b

Reflow profiling of double sided assemblies

Electronics Forum | Fri May 24 19:18:03 EDT 2013 | hegemon

The formula is a great help, where was it 20 years ago? LOL After running a few thousand different products over the years, you start to get a feel for what is going to be trouble with regards to falling off the bottomside during the secondary refl

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Re: Solder Shorts Under SMT Resistors/Capacitors

Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F

| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo

Condensation Soldering

Electronics Forum | Fri Oct 19 01:33:30 EDT 2001 | ianchan

Hi, Encountered this deference to the vapour phase process that was supposedly "phased" out years ago? *pardon the pun* Any comments from folks who have used this proces before? how about folks who are currently using this process? even better, a

Mydata sod523 pickup problem

Electronics Forum | Tue Mar 04 17:17:29 EST 2014 | catsem23

Hi I'm trying to pick and place a lot of sod523 components with a mydata my12. I'm using C14 standard tool and Hydra tool H01. For some reason no matter what I try to do when the head picks the component with the C14 tool the machine emergency stops


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