Electronics Forum | Thu Oct 24 17:23:12 EDT 2002 | slthomas
The logical course seems like you would just back off on the shot size or go with a smaller diameter nozzle, but if this is something new and you've been running fine up until recently then something has changed. Check the condition of your nozzles.
Electronics Forum | Tue Jun 10 11:07:33 EDT 2003 | fmonette
Another important element to consider is the impact of ambient temperature and humidity on Moisture Sensitive Components. The majority of plastic encapsulated ICs are classified as moisture-sensitive devices (MSD). This means that they are qualifie
Electronics Forum | Mon Mar 07 21:37:42 EST 2005 | ABHI
It depends on your product requirements. I have seen aluminium wire bonding operations in as high as class 100K clean rooms. These are the assembly areas for calculators. The best is class 10K clean room for wire bonding. You can go upto fine pitch w
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas
Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r
Electronics Forum | Thu Oct 05 07:23:34 EDT 2006 | Chris
Hi all experts, I have no background about PCB or SMT process. I am now encountering some issues after SMT - Unstable stitch bonding condition. I am now suspecting some contaminants remain on lead after cleaning. Therefore, how can I check th
Electronics Forum | Tue Feb 20 06:05:10 EST 2007 | mk
Thanks to all for the info. The ideas to correct the situation are all excellent and if we see any more boards from this source with this condition we will know what to do now. In the end however, the real questions we are trying to answer are, 1.I
Electronics Forum | Thu Aug 07 17:25:11 EDT 2008 | jlawson
With Laser centering nozzle condition in terms of slider shafts have to return to same position every time. Please check condition of nozzle and make sure slider extends to full position. If slider sticks it can generate errors as the component appea
Electronics Forum | Thu Oct 25 13:33:18 EDT 2012 | cyber_wolf
Ken, The photo looks like results I have seen because the gold flash was too thick on the board. This causes a condition known as gold imbrittlement. You may want to get an analysis of the plating thickness. I'm not real experienced with immersion si
Electronics Forum | Thu Jun 02 20:40:31 EDT 2016 | davef
In “SMT Equipment Parts & Supplies Marketplace. MPM Equipment Parts Parts & Supplies” [http://www.smtnet.com/parts/index.cfm?fuseaction=browse_mart&category=&mfg=120&condition=&listing_type=] lists 223 parts for MPM equipment. In “SMT Equipment & P
