Electronics Forum | Tue May 28 14:01:09 EDT 2002 | zanolli
Hello Sally, The force required for press fit connectors will vary depending on the connector type. The force will also very significantly from one supplier to another for the same connector. To give you an example; for a .100" DIN 41612 connector
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp
Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger
Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef
This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g
Electronics Forum | Sat Mar 01 16:46:26 EST 2003 | MA/NY DDave
Hi Hey thanks, you are welcome for the link. Well to be precise dissimilar metals will corrode at some rate and also depends on the environment. Look at a Galvanic Table. Yet maybe for your application and the ones AMP designed this part for, the c
Electronics Forum | Thu Jan 08 14:33:50 EST 2004 | dwzeek
Toe fillets are not required per IPC. Toe fillets could be used as a process indicator, if you desire; I would not. Gull wing leads are typically cut off on the ends when manufactured; this exposes the non-plated material in the lead, typically coppe
Electronics Forum | Fri Jul 09 06:40:16 EDT 2004 | Chris Lampron
WA Engineer, Good Morning, Your cleaning system requirements will depend on your chemistry use in production. Are you using RMA or OA flux? This will impact the requirements of the cleaning system. OA will allow you to use a DI water cleaner. If you
Electronics Forum | Wed Sep 08 20:48:36 EDT 2004 | peter016
Hi Rob, I guess the ratio between chipmounter and GSM is very much depending on the chip to ICs ratio. This is product dependent. We use 2 HS50 to 2 GSMII, 5 S20 to 2 GSMII, 3 Sanyos to 2 GSMII, and 2 CP6 to 2 GSMII. Are these ideal ratios ? Lean Ma
Electronics Forum | Thu Oct 28 05:35:49 EDT 2004 | rlackey
Dave, I think you'll find you'll score higher if you add a cheeky half twist - you'll get a higher difficulty multiplier on your final score. Profiling is highly dependant on the quality of your oven, number of zones, temperature profiling tools et
Electronics Forum | Mon Nov 22 11:19:39 EST 2004 | davef
Short answer: Yes. Depending on the application of the conductive ink, suppliers select different mesh for the silver particles. So, you should follow your supplier's recommendations for printing, for instance: Conductive Ink||PI-2000 Highly Condu
