Industry News | 2019-01-15 19:43:33.0
Engineered Material Systems is pleased to debut its TM-6520 low temperature cure adhesive. Designed for die attach and general circuit assembly applications, the adhesive is electrically insulating and offers high thermal conductivity.
Industry News | 2014-02-11 15:25:57.0
Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.
Our MW Series of ultra soft-fabric wrapped shielding profiles utilises a highly conductive and durable impregnated fabric formed around a sponge or foam core to create a very versatile low compression gasket medium Our MF Series is a range of highl
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2009-09-09 20:07:33.0
Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.
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Used SMT Equipment | Adhesive Dispensers
Asymtek Millennium 600 Epoxy Dispenser For Sale Vintage 1998 Integrated mass flow calibration system automatically compensates for changes in fluid viscosity Full temperature control of fluid delivery with closed-loop substrate heating to
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
Industry News | 2018-09-05 20:16:30.0
Engineered Material Systems debuts CA-188-1 low-temperature cure electrically conductive adhesive for die attach and general circuit assembly applications.
Industry News | 2002-03-13 07:31:38.0
Loctite Corp. has been named a recipient of Intel Corp.'s (Chandler, AZ) 2001 Supplier Continuous Quality Improvement (SCQI) award for outstanding commitment to quality and performance by suppliers providing products and services deemed essential to Intel's success. The company was recognized for its efforts in supplying Intel with die attach adhesives and underfill materials. All SCQI award winners will be honored at a celebration in Burlingame, CA on March 13, 2002.
Industry News | 2022-11-08 14:43:06.0
YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category! This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.
