Electronics Forum | Mon Jun 18 08:15:29 EDT 2001 | zanolli@tekais.com
Dear Jack, If you are trying to attach a connector - contact me offline or go to http://www.tekais.com. Teka offers a technology that deposits enoough solder volume on connectors for thicker PCB's.
Electronics Forum | Fri Jan 09 18:28:34 EST 2004 | Ron W
I'd like to know if anyone could recommend a good high-temperature adhesive that can be used for thermocouple attachment. I've always used high-temp solder and tape in the past, but would like to try using adhesive. Any info is certainly appreciated.
Electronics Forum | Sun Oct 31 06:42:28 EST 2004 | mattkehoe
Can BGA's really be reliably attached without adding any extra paste? Just use the BGA balls and tacky flux? We are interested in the Pro's and Con's. Seems like a lot of different opinions out there.
Electronics Forum | Thu Apr 06 13:33:10 EDT 2006 | marla
Hello Dougs: Have you tried stenciling solder paste to the BGA part itself. You will find this most helpful for your heat transfer and attachment integrity of the component in a Pb free process.
Electronics Forum | Sat Mar 30 13:33:50 EDT 2019 | stephendo
This is not an HVAC unit. This is a small unit attached to a production machine to keep the solder paste from drying out prematurely or slumping. The volume of air being cooled and desicated would be less than 3 or 4 cubic meters.
Electronics Forum | Wed Jul 24 10:07:44 EDT 2019 | ameenullakhan
Hi Team, Can anyone suggest me best stencil opening for CCGA. Attached is the component details. Solder paste : water solube - ORL0 - Jtsd 001 ( Sn63/Pb37) Any one has qualified the same. Regards, Ameen
Electronics Forum | Thu Apr 28 09:01:38 EDT 2022 | saberbouras
I have a solder paste fridge; my question is what is the type of this connector so I can use it to attach a warning light. And is it a power source or is it a dry contact relay output?
Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano
Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and
Electronics Forum | Tue Jul 28 16:37:24 EDT 1998 | Terry Burnette
| I think that in general it's best to deposit paste in order to increase the part standoff. This helps improve the fatigue-life of the joints by providing more strain relief. But I know from experience that it's tough to deposit paste during the r
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
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