Electronics Forum: dissolution (Page 9 of 11)

Dealing with TH Barrels on Bds w/Heavy Ground Planes

Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef

A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta

SN100C Selective Solder Voiding

Electronics Forum | Wed Nov 12 18:58:19 EST 2008 | joeherz

I attended SMTA's copper dissolution webinar this morning and am almost convinced that this is not our problem. Still planning to do cross sections to verify but our dwell times are nowhere near levels that could cause a problem assuming good platin

Sn100C - anyone use this at Reflow?

Electronics Forum | Wed Mar 18 16:50:20 EDT 2009 | khowell

There are many users of SN100C in reflow. SN100C was originally introduced as a wave solder alloy which offered cost savings over SAC, no solder pot erosion, and high fluidity. Since it is eutectic, no plastic range, the joints have a smooth, shiny

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 03:55:45 EDT 1999 | Brian

| We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a reco

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 16:57:14 EDT 1999 | JohnW

| | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | Leaching. Dissolution of a metal coating into liqu

Re: Surface Mount assemblies IPC Standards

Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F

| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating

SN100C vs. SAC 305 wave soldering

Electronics Forum | Wed Jan 11 18:44:42 EST 2006 | fctassembly

Hello Greg, Glad to hear your success with the SACX0307 copy. By the way, does the P mean it contains phosphorus? Does yours also contain bismuth like the SACX0307 (according to their plumbing solder patent for X0307)? In response to your discussion

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Test the solder point

Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F

Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re


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