Oak-Mitsui has developed a novel thin substrate, FaradFlex�, which is the next generation of Buried Capacitance material. Buried Capacitance utilizes the technology of putting a capacitor plane inside the PCB to reduce the overall impedance of the po
M.G. Chemicals products include dusters and circuit coolers, cleaner / degreasers, flux removers, contact cleaners, protective coatings, epoxies, adhesives, RTV silicones, lubricants, EMI/RFI shielding coatings, thermal management products, prototypi
Atomated, semi-automated, and manual assembly Ribbon cable, coax, wire harnesses, and electro-mechanical assemblies. Distribution: Let us ship directly to your customer! This saves you cost and lead time. Depot Repair: By letting us handl
New Equipment | Test Equipment
The TDS3054 Digital Phosphor Oscilloscope (DPO) features advanced waveform capture, display, and measurement capabilities. The instrument delivers three dimensions of signal information (amplitude, time, and distribution of amplitude over time) in re
New Equipment | Cleaning Agents
Chemicals & Cleaners from Loctite, Circuit Works, Chemtronics, JNJ, TechSpray, Excelta, Gordon, Menda, MicrCare, Kester, ACL, R&R, 3M, Edsyn, Hakko, OKI, Branson, Coventry, Desco, Kimberly-Clark, Puritan. Alcohol Brushes Contact Cleaners Degrea
New Equipment | ESD Control Supplies
ESD & Static Control products from Desco, Tech Wear, 3M, Akro-Mils, CCI, Lewis Bins, Protektive Pak, Quantum, Metro, Menda Apparel, Badge Holders & Shop Travelers, Bags & Packaging, Binders & Clip Boards, Bins & Boxes, Chemicals & Dispensers,
New Equipment | Rework & Repair Equipment
Solder, Desolder & Rework equipment from Chemtronics, Easy Braid, TechSpray, Xuron, Edsyn, Hakko, Hexacon, Metcal, OKI, PACE, Weller, Plato, BeauTech, CircuitWorks, Excelta, Menda, Aven. Desoldering Wick Iron & Pencil Stands Solder & Desolder I
New Equipment | Test Equipment
Vigilant provides an array of component testing and verification services. Not only do we test and verify all electronic components we source, but we can also provide a full component test and verification service for components our customers have p
Layer count of mass production is 1L to 26L, including regular PCB, heavy copper PCB, Aluminum/Copper based PCB, Hybrid PCB, HDI etc.Applications cover power supply, telecom,fiber optics, industrial control, Auto, consumer electronics Most of the pro
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
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