Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Sun May 19 06:43:37 EDT 2002 | xzinxzin
I using water-soluble solder paste, the solder paste recommended, the peak temperature is 215 deg C, the dwell time above 183 deg C is 60-90 sec. **How I can do, the flux in solder paste is active enough to remove the corrosion on the Cu leads to get
Electronics Forum | Fri Mar 26 08:49:22 EST 2004 | patrickbruneel
Dear Sir, If you are looking for the best bang for the buck you will have to stop cleaning and use a no-residue paste instead of a no-clean. No-residue chemistry becomes totaly volatile in dwell time above reflow resulting in residue free boards. I
Electronics Forum | Mon Aug 29 11:42:35 EDT 2005 | pr
If you are talking about smt components I'd say absolutely not. If these are through hole components I'd say possibly (if they are in rows, and not a whole lot of them). The machine is slow, but the quality is great. Creating a wave profile takes abo
Electronics Forum | Thu Nov 10 13:55:25 EST 2005 | 1st Article
Milroy, Another thing to look at is your wave profile. Check speed and pre-heat, if flux gets burned off before reaching the wave then bridging is expected, a common way to check for speed is to time the point of first contact through the sub-merge
Electronics Forum | Mon Jul 14 15:44:19 EDT 2008 | stepheniii
when you change one of previous mentioned > parameters. Contact length with the board should > never change when the conveyer speed is changed, > only contact time should change. If I understand correctly then if you change nothing else, dwell t
Electronics Forum | Wed Feb 04 08:49:52 EST 2009 | milroy
Hi First of all you have to respect the dwell time and the time after the reflow at peak tmeperature.(225�C for Pb and 235�C for Pbf) You can find the reflow profile from manufacturer for majority of parts designed for reflow sodlering. In general t
Electronics Forum | Fri Jan 07 03:34:12 EST 2011 | rpatel28364
Hi Smarts We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste. but our customer is saying they have to heat up BGA and board s
Electronics Forum | Wed Nov 12 18:58:19 EST 2008 | joeherz
I attended SMTA's copper dissolution webinar this morning and am almost convinced that this is not our problem. Still planning to do cross sections to verify but our dwell times are nowhere near levels that could cause a problem assuming good platin
Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
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