Industry News | 2013-06-24 16:56:57.0
Headquartered in Sweden, NCAB Group, announces the appointment of Wayne Antal as Key Account Manager.
Industry News | 2014-01-29 11:09:40.0
Indium Corporation announces that Glen Thomas has been named Product Manager for PCB Assembly Solder Paste.
Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
Industry News | 2010-08-04 16:28:25.0
Catalyst Manufacturing Services is pleased to announce the acquisition of the PCBA Division of Harvard Custom Manufacturing, Inc. (HCM) based in Owego, New York, effective August 4, 2010.
Industry News | 2010-12-23 01:20:17.0
P. D. Circuits, Inc. has appointed Dan Spencer as Western Regional Sales Manager.
Industry News | 2016-07-21 19:17:50.0
Universal Instruments is pleased to announce the appointment of Jeff Knight as General Manager of the Advanced Process Lab (APL) and Advanced Technology Assembly Services (ATAS). Knight will operate out of the company’s corporate headquarters in Conklin, NY and will be responsible for generating new business opportunities for Universal’s advanced technology groups at both the Conklin and Rochester, NY facilities while also ensuring an exceptional level of support and success for the existing customer base.
Industry News | 2010-10-20 23:29:54.0
Viasystems Group, Inc. and Faraday Technology, Inc. are collaborating on demonstration of the FARADAYIC(R) ElectroCell technology for the manufacture of printed circuit boards (PCBs) with high-density interconnect features and at high plating rates for improved productivity.
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Industry News | 2012-03-15 18:09:12.0
Kyzen will co-host a workshop with ACI Technologies, Inc. to discuss circuit board cleaning and conformal coating. The workshop is scheduled to take place March 21-22, 2012 from 8:30 a.m.-4:30 p.m. at ACI’s facility in Philadelphia, PA.
Industry News | 2001-02-12 09:01:16.0
W. L. Gore & Associates, Agilent Technologies, and Mitel Corporation today announced that they have signed a Multi-Source Agreement (MSA) that will set the industry standard for next-generation parallel fiber optic modules. The three companies have leveraged their wide range of experience in fiber optic and semiconductor technologies to standardize the package and optical and electrical interfaces for their respective modules to ensure that customers will have access to multiple international sources that are compatible with other components within their systems. Each of the companies expects to offer the modules in 2001.
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