Full Site - : excess flux after reflow (Page 9 of 77)

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Industry News | 2016-07-11 20:50:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

Desktop Reflow Oven R3028

Desktop Reflow Oven R3028

New Equipment | Reflow

Introduction This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the tempe

HuiKe Tech

Desktop Reflow Oven R1825

Desktop Reflow Oven R1825

New Equipment | Reflow

This oven is used for electron production and maintain of SMT technique. The product adopts the far-infrared heating components and excellent sense temperature materials. Through the precise control of the microcomputer, make the temperature control

HuiKe Tech

Indium Corporation Introduces Liquid Flip-Chip Flux

Industry News | 2022-03-09 12:32:53.0

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications.

Indium Corporation

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

Small Style Vacuum Soldering Furance  KD-V20 for  IGBT Module

Small Style Vacuum Soldering Furance KD-V20 for IGBT Module

New Equipment | Soldering - Other

        Small Style Vacuum Soldering Furance  KD-V20 for  IGBT Module   Application :  IGBT module    MEMS   Large power modules package Optoelectronic package    Hermetic Seals  Feature : 1. Viewing system: Cavity with a visual window, can

Beijing Chengliankaida Technology Co.,Ltd

TSM A70 Series Air Convection Reflow Ovens

TSM A70 Series Air Convection Reflow Ovens

New Equipment | Reflow

RTPM (Real Time Temperature Profile Monitoring System) Option Set the optimum profile and checks if the set profile is maintained within the error range by measuring the temperature in the oven in real time. (alarm sounds when there is an error)

Apex Factory Automation

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems

New Equipment | Reflow

8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems 8-Zone SMT Reflow Oven-8-zone Reduced-Length Lead-Free Convection Reflow Soldering Systems Introductions:  The mainly component is adopted international bran

Beijing Torch Co.,Ltd

SHENMAO Develops New Joint-Enhanced Flux

Industry News | 2020-11-09 14:21:48.0

SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.

Shenmao Technology Inc.

Excellent Drainage Properties of SN100C Confirmed in “Icicle” Test

Industry News | 2011-11-08 12:53:43.0

Nihon Superior is proposing that its “Icicle Test” is one of the criteria electronics manufacturers should consider using as they struggle to find a basis for choosing between the various lead-free solders being offered for wave soldering.

Nihon Superior Co., Ltd.


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