Industry News: expose (Page 9 of 22)

Engineered Material Systems Introduces 535-10M-49 UV Cure Adhesive

Industry News | 2014-03-31 16:21:29.0

Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.

Engineered Materials Systems, Inc.

Standard Gerber Declared Obsolete.

Industry News | 2014-06-24 14:40:24.0

Standard Gerber is technically obsolete. If you are still using it, you are putting your business and that of your clients and business partners at a useless risk, without benefit.

Ucamco

Engineered Material Systems Introduces a New 535-11M-3 UV Cure Adhesive

Industry News | 2015-01-27 09:40:03.0

Engineered Material Systems is pleased to debut its 535-11M-3 UV cured epoxy. 535-11M-3 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.

Engineered Materials Systems, Inc.

Science and Care Converge for Advanced Packaging – See KYZEN at NEPCON Korea

Industry News | 2015-04-02 10:28:43.0

KYZEN’s innovative new product technology team will exhibit in the InterCEM booth C111 at Electronics Manufacturing Korea, scheduled to take place April 1-3, 2015 in Coex, Seoul. Company representatives will showcase a full line of products for electronic assembly and advanced packaging cleaning.

KYZEN Corporation

KYZEN Combines Cleaning and Care at SEMICON Southeast Asia

Industry News | 2015-04-06 12:08:31.0

KYZEN’s innovative new product technology team will exhibit in booth #101 at SEMICON Southeast Asia, scheduled to take place April 22-24, 2015 at the SPICE Arena in Penang, Malaysia. KYZEN’s team will display a full line of products for electronic assembly and advanced packaging cleaning including MICRONOX® 2710 and MICRONOX® 2707.

KYZEN Corporation

Engineered Material Systems Introduces New 535-11M-7 UV Cure Adhesive

Industry News | 2015-04-20 18:19:42.0

Engineered Material Systems is pleased to debut its 535-11M-7 UV cured epoxy. 535-11M-7 was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications.

Engineered Materials Systems, Inc.

Morgan’s Seals and Bearings receive favorable FDA letter of opinion for use in food processing applications

Industry News | 2015-10-19 12:58:40.0

Morgan Advanced Materials announces it has received a favorable letter of opinion from the U.S. Food and Drug Administration (FDA) for a variety of its carbon/graphite, sintered silicon carbide, and reaction bonded silicon carbide materials produced by its Seals and Bearings business. The letter of opinion covers repeated-use, wear components for food applications, including mechanical face seals, bearing, bushings, vanes, and rotors.

Morgan Advanced Materials

GS Swiss PCB Expands Production Line by Laser Direct Imaging System NUVOGO 800

Industry News | 2016-04-20 05:16:34.0

GS Swiss PCB Expands Production Line by Laser Direct Imaging System NUVOGO 800 GS Swiss PCB, a member company of exceet Group, is continually investing in the machine pool at its plant in Küssnacht on the Rigi. GS Swiss PCB is a leading manufacturer of reliable, highly miniaturized flex, rigid-flex and HDI circuit boards (high density interconnect) for use in products such as medical implants and hearing aids. GS Swiss PCB is now investing approx. EUR 750,000 in a latest-generation direct imaging system – a further step on the way to modernizing the imaging process.

GS Swiss PCB AG

Eunil Presents the Highly Accurate ECM-350 Table Coating Master

Industry News | 2016-06-21 15:35:10.0

Eunil, a worldwide leader in factory automation as a manufacturer of SMT peripheral equipment, presents the ECM-350 Table Coating Master, a highly accurate offline machine for small-quantity batch production.

Eunil H.A. Americas, Inc.

SEMICON West

Industry News | 2017-06-13 20:22:20.0

Today KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature MICRONOX® 2707 for Cu pillar flip chip applications.

KYZEN Corporation


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