Electronics Forum: face (Page 9 of 70)

DEK265gsx inconsistency in management f

Electronics Forum | Thu Feb 22 19:37:48 EST 2007 | vshan

Hi All im facing an issue with my DEK. Once the middle sensor detects the board, the stopper does not able to stop the board on time. i have checked all the basic parameters. Can anyone help me rgd vshan

LGA Processing

Electronics Forum | Fri Mar 30 23:07:13 EDT 2007 | mika

And how about the queston: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=11592&mc=7 We face a big problem with this matter right know. /

Thermal Mass Differences in PCA

Electronics Forum | Fri Nov 02 10:57:11 EDT 2007 | 85638

7500 mm3 in combination with very small devices like 0402 in the same assembly ?. I am facing profiling problems due to this extreme mix. Thanks in advance for your valuable inputs.

Anyone facing QFN package crack problem ?

Electronics Forum | Tue Nov 27 20:51:18 EST 2007 | chs

Anyone can share experience on package crack for QFN package. This package is so sensitive to any external force. Any good recomendation on desoldering / rework procedure.

Interesting

Electronics Forum | Mon Jan 28 07:29:33 EST 2008 | davef

Se�or Tech: I wouldn't be able to keep a straight face making a presentation on a topic like that one.

Board Warpage

Electronics Forum | Tue Apr 29 02:08:21 EDT 2008 | sin4d

Hi, I am also facing the same probelm. I assembly a substrate with a thickness of 0.30mm and the board warp after reflow. If I bake the substrate at 125 Deg C for 2 hours will it help to solve this problem? Thanks

BGA Rework

Electronics Forum | Fri Jul 04 15:53:04 EDT 2008 | mbnetto

I have a Fonton equipment for BGA reworking. I'm facing some problems to rework BGAs lead free from VIA manufacturing, used on notebooks boards. Could anybody help me, sending me a profile to test or some hints??? Thanks a lot!

pcb track liting problem

Electronics Forum | Sat Jul 26 11:17:31 EDT 2008 | manishc

i am facing problem of pcb track lifing at B.G.A. after reflow.we r using lead free paste and fr-4 grade pcb with peak temp.about 270 deg.

Less solder with fine pitch qfp

Electronics Forum | Mon Sep 29 11:44:39 EDT 2008 | manishc

We r facing less soder problem with qfp,using 4 mil tencil and lead free paste,tried out different combinations of reflow profile,can anybody suggest?

Lead Free finish

Electronics Forum | Wed Oct 29 03:39:31 EDT 2008 | milas

Thanks for the feedback dave. What kind of problems am I liely to face if I was to stick it out with my current specification ?


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