Electronics Forum | Mon Sep 26 20:10:58 EDT 2005 | Anna
What type of alloy and at what temperature do you use for wave soldering? Do you need to modify your machine? I am using SCN but I have problem controlling my bath. Are you running on multilayer board or PTH boards? Do you face any fillet lifting
Electronics Forum | Wed Aug 03 21:29:59 EDT 2005 | Ken
Yes, lead can promote fillet lift. In order to understand this defect you must begin looking at your lead frame mateials. some lead frames are more susceptable to this disorder. This is most likely a cte mismatch disorder. Lead contamination in
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
Electronics Forum | Mon Dec 18 08:52:57 EST 2006 | russ
You need to get yourself a copy of IPC 610. this has all the specs regrding placement and registration. chip aprts are allowed to have 50% side overhang. the fillet requirements are "evidence of wetted fillet" . I would not know if a cap being 51
Electronics Forum | Wed Apr 11 20:49:39 EDT 2007 | raychamp007
3W. Figure 8-84 shown evidence of heel bend wetting(but no written criteria mention about the solder fillet must present at the heel bend). It is acceptable if the minimum D(3W/75%L)extend from toe which is no evidence of solder fillet at heel bend?
Electronics Forum | Tue Mar 08 02:28:03 EST 2011 | nagesh
I have an issue with PLCC Insufficient Heel solder joint fillet.The aperture dimension is : 30 x 100 mils on PCB & on stencil also(1:1 per gerber).Rohs Process. My stencil thickness is 5mils due to presence of Tssop & QFP package & i cannot increase
Electronics Forum | Mon Aug 22 06:30:59 EDT 2011 | janz
very often toes on the QFP packages are exposed to base material and during time they oxidize. That is why you can have problem with solder fillet. Most important is heel fillet. Regarding your misalignment of IC if this is repeatable check your pl
Electronics Forum | Sat Aug 25 23:01:45 EDT 2012 | ssridhar
Hello jdumont, I think the spheres are leaning as there is not enough meat under the spheres. In ceramic BGA devices there is a solder fillet which is generally a solder paste which is used to give the device some height before balling it. This heig
Electronics Forum | Wed Aug 07 16:33:08 EDT 2013 | rway
I did not see the histogram image (didn't scroll down). My point about the flat metal surfaces is they should have a large white total under top-light with red filter. You should be able to distinguish between the two (fillets and no fillets). I k
Electronics Forum | Mon Dec 21 09:53:12 EST 2015 | proceng1
What part do you think is a defect? You can see by the board that the two leads are electrically connected anyway. If you mean that the outside fillet on the right is shorter, just look at the board. It looks like you have solder mask encroaching
