Full Site - : gel flux (Page 9 of 10)

BGA relow without solder paste?

Electronics Forum | Tue Sep 20 17:09:14 EDT 2005 | hly

I have a situation with hot boards with fine pitch BGAs that I need to build. However, there is a big problem--the auto screen printer is down. I decided that we would use the stencil and manually line up the pads and do a manual print. I can't ac

BGA Placement Process

Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet

One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun

Reworking BGA's

Electronics Forum | Thu Sep 22 10:28:48 EDT 2011 | davef

We agree with you. Recognize that these new solder connections have less metal and a lower standoff than similar BGA solder connections that have not been reworked. This could reduce the reliability of your product, somewhat. Flux or gel may be use

BGA Reballing Machines

Electronics Forum | Tue Mar 22 17:08:01 EST 2005 | finepitch

We might need to open up the term "mass production" here, but I will give it a try anyway. I've seen semiconductor packaging companies in the far east where they pick up balls with a vacuum head, consisting of holes matching the pattern of the BGA p

BGA Placement Process

Electronics Forum | Fri Mar 26 15:36:50 EDT 2010 | krish_bala

Hello Graham, We are currently using Tacky Gel Flux during our replacement process. We dip the BGA component on the flux prior to placement. Once it is dipped, the alignment and placement is done. As for the profile, I believe I am hitting the corr

Flip Chip

Electronics Forum | Mon Apr 23 11:58:42 EDT 2001 | CAL

I personally like Universals GSM and the Siemens F series for placement machines and companies. Both have great laboratorys set up for Flip Chip processing.Both Also have industry leading experts on staff. Machine info: can they do tacky flux dispen

Re: BGA Repair Problems

Electronics Forum | Wed Aug 12 14:39:09 EDT 1998 | Mike C

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

BGA rework using Tacky Flux

Electronics Forum | Fri Jan 13 13:43:51 EST 2006 | russ

As far as I have determined, the Gel and Tacky are the same animal. Just flux works well, I did forget to mention that this flux only method will not work with a CCGA (Ceramic Column Grid Array) since these columns are not meant to be reflowed.

Luxeon Lumiled

Electronics Forum | Tue Nov 16 11:11:18 EST 2004 | iva

Hello Charlie, For Application of thermal conductive glue by dispensing, Luxeon recommends Amicon E3503 from Emerson and Cuming (www.emersoncuming.com) for its standard Luxeon Power Light Sources. For optimal thermal connection it is important that

Air Quality sensor for smt area

Electronics Forum | Tue Feb 07 11:55:27 EST 2023 | tommy_magyar

What I would look at is the chemicals being used in the facility where the complaints are. Flux/flux gel, IPA, cleaning agents, etc. Perhaps you should limit the usage to certain people only, who would be trained how to properly use these. Something


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