Technical Library | 2020-01-09 00:00:30.0
PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.
Electronics Forum | Tue May 02 01:42:02 EDT 2006 | ge_lim
Hi Anyone has used Kera-clean Dross Ex to clean the dip soldering nozzle before? This product is from Kera-Technik@gmx.de, GmbH, Germany, and has been quite effective in removing the dross residue on the nozzle. Tell me is there a similiar product