Electronics Forum | Thu Nov 11 15:55:53 EST 2010 | davef
We guess the nickle has a rougher that normal finish AND the gold is at or below your specification. The nickle bumps are poking through the gold and are oxidized, preventing contact with you ATE probes. If this is correct, it would be interesting
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Mon Dec 13 00:05:28 EST 1999 | Dennis O'Donnell
I can't figure out why everyone is plating everything with gold. According to the J Standard, gold plating should be removed before soldering to the surface. The gold, when left on the surface to be soldered will contaminate the solder joint and ca
Electronics Forum | Wed Jul 12 11:26:12 EDT 2006 | flipit
Hi, I believe you have classic gold imbrittlement here. With 80 microinches of gold you are way over the limit. You can try to reflow longer time and at a higher temperature. The gold does not melt into the solder joint. The gold dissolves into
Electronics Forum | Mon Dec 06 09:16:22 EST 1999 | Dave F
Russ: Three things: 1 Wolfgang is 100% correctamundo about the slow dissolution rate of gold 2 Shear stength of the gold 63/37 solder connection decreases rapidly, as the gold content of the solder connection increases above 2%. 3 There are many
Electronics Forum | Sat Jul 29 13:36:57 EDT 2006 | Chunks
Davef is right about the amount, but why are using gold to solder too when other finishes are avaiable?
Electronics Forum | Wed Jul 12 11:46:00 EDT 2006 | flipit
Hi, One other note. You don't want gold to be more than 1% to 2% of the the solder joint. Above this percentage you will have embrittlemant issues. Lots of information on gold embrittlement on this site and on the Internet. I estimate your produ
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Sat Dec 04 09:33:18 EST 1999 | Christopher Lampron
Hello Russ, I believe that the dullness in color of the solder joint is related to the gold finish on the pads. I have had done alot of thru hole soldering of gold pins as well as SMT on gold finish and have seen the condition that you are talking a
Electronics Forum | Thu Jul 03 11:36:57 EDT 2003 | Ron
Have you considered a temporary water washable solder mask. Elvaway solder mask tapes have been protecting Gold Fingers during soldering and simply wash away in a water wash process and leaves no residue.
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