Electronics Forum | Wed Nov 03 04:02:51 EST 1999 | Wolfgang Busko
Hi Wes, it may not be the same but I had a problem with one Phillips machine which started unpredictible mismounting all components about 1mm. When it occured you couldn�t get it do it right again unless you turned it down and restarted it. The servi
Electronics Forum | Thu Oct 01 11:40:17 EDT 1998 | Justin Medernach
Are there anyone who can give me the answer about solder ball problem? | We have 12 layer PCB and double sided PCB. After one side reflow soldering We found lots of solder ball under the PCB. The solder ball was coming out from via hole. | So
Electronics Forum | Thu Jul 09 11:20:24 EDT 1998 | Justin Medernach
| I am looking for a little enlightement with an issue that we have been seeing. We have printed curcuit board with multilayer and HAL finished. | After reflow soldering, we have often "blister phenomenon". | Our reflow profile is normal. Factory
Electronics Forum | Thu Apr 24 23:04:45 EDT 2003 | yukim
I've been struggling with this problem for a while. We have two products: A, which is Ok and B, with tombstone defect (0603 & 0805 capacitor chips). A & B have the same design: pad sizes, separation between pads, components orientation. Both have s
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef
It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu
Electronics Forum | Wed Feb 26 04:28:39 EST 2014 | chongns
Hi All member I have a problem on the stable down the color of the white solder mask PCB. first, i tough the color differences was cause by the solder mask ink, but after a close look, the color change are cause by the copper under the solder mask
Electronics Forum | Tue May 20 18:38:23 EDT 2014 | hegemon
From the picture I would say the problem lies with the PWB manufacturer. It looks as though some part of the plating process was not optimal during the PWB production run, and you have the resulting discoloration following the reflow process. What
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Tue Dec 22 12:32:16 EST 1998 | Earl Moon
| Folk's, | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colour, texture,
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