Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Thu Oct 17 12:58:15 EDT 2002 | babe
I agree with everything stated thus far. However, what soldering iron are you using. You may be able to solder the pin with an iron that delivers continuous heat and if there is room utilize a large tip as a heat reservoir. What happens is that the i
Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975
We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have
Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW
| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar
Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola
| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the
Electronics Forum | Fri Mar 21 11:25:07 EST 2003 | jonfox
His subject line is "Tantalum caps causing misaligned parts". Come on guys, I think he answered the question already. Is there any via/traces that connects the pads of the TANT to the 0805 and the BGA. Your two parts may be physically the same, bu
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Thu Jul 20 12:19:24 EDT 2000 | Dave F
Bob: Techniques for removing RFI / RF shields vary according to the size and type of shield. Removing: * PTH RFI / RF shields is as straight forward as the next heat sinking PTH component, often using a solder bath or fountain. * Small SMT RFI /
Electronics Forum | Fri Jun 12 11:15:50 EDT 1998 | Ryan Jennens
Hey all! The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pallet w
Electronics Forum | Wed Apr 06 11:58:02 EDT 2005 | patrickbruneel
Hi SMT Engr With a double-header connector do you mean Double Level Right Angled Header Connector. If so there is a big difference in heat sinking capacity between the two rows, as where the pins of the top connector absorbes twice as much heat as t
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