Full Site - : heatsink (Page 9 of 26)

Würth Elektronik Expands its Service Portfolio

Industry News | 2013-06-03 11:00:12.0

The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.

Würth Elektronik GmbH & Co. KG

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-06 04:53:14.0

MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Exhibit and Promote Recent Product Launches at Semicon Taiwan

Industry News | 2020-09-10 11:09:50.0

MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to be a Supporting Partner at the Upcoming IMAPS Device Packaging Conference

Industry News | 2021-03-31 17:56:27.0

MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.

MacDermid Alpha Electronics Solutions

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

PACE IR 3000 Infrared BGA/SMT Rework System

PACE IR 3000 Infrared BGA/SMT Rework System

New Equipment | Rework & Repair Equipment

Production BGA Installation & Rework WITHOUT the Expensive Nozzles! The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W in

PACE Worldwide

Conductive polymer protected due to secrecy by Würth Elektronik offers printed pulse resistors covering different voltage range

Industry News | 2009-08-04 16:55:04.0

Niedernhall, 2009, August 4 – PCB expert Würth Elektronik’s printed pulse resistors achieved the till now claimed impossible high-voltage range of 200,000 V. That has been realised once more by the Würth Elektronik-owned “smart-conductive polymer thick film systems”, outstanding due to a wide variability of resistances.

Würth Elektronik GmbH & Co. KG

Parvus Announces Availability of Four Rugged Celeron-based Embedded Computers: SpacePC 1450, 1451, 1453, and 1850

Industry News | 2005-04-20 13:21:59.0

New PC/104-Plus SpacePC CPUs combine fanless -40C to +85C extended temperature operation with 256MB of soldered RAM for high reliability in mobile computing applications

Parvus Corporation

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Industry News | 2010-09-30 17:36:09.0

Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.

Saturn Electronics Corporation

FINEPLACER® Micro Assembly Highlights at Productronica 2011

Industry News | 2011-08-30 20:10:58.0

At this year’s Productronica 2011, booth #A4-281, Finetech will present selected highlights from the acclaimed FINEPLACER® bonder range.

Finetech


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