Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
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Industry News | 2014-01-21 18:29:32.0
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose.
Industry News | 2014-09-25 19:27:35.0
The world market for PCBs declined an estimated 2.2 percent in real terms in 2013, although real growth in North America was positive at 0.8 percent, according to IPC's World PCB Production Report for the Year 2013. Developed by a team of the world's leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating what kinds of PCBs are being made where. World PCB production in 2013 was valued at an estimated $59.4 billion.
Industry News | 2022-10-20 14:32:44.0
Full-auto SMT Production Line includes solder paste printer machine, SMT placement machine (upper surface electronic components), reflow soldering oven machine, plug-in, wave furnace, testing machine etc. The wide application of Full-auto SMT Production Line promotes the miniaturization and multi-function of electronic products, and provides conditions for mass production and low defect rate production.
Industry News | 2022-07-25 08:18:26.0
IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.
Industry News | 2013-07-19 11:27:23.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 10th Annual International Wafer-Level Packaging Conference.
Industry News | 2024-03-04 12:05:31.0
IPC praised today's issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a Notice of Funding Opportunity (NOFO) for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials.
Industry News | 2024-03-26 13:01:29.0
Devan Iyer, Ph.D., one of the semiconductor industry's leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
