Electronics Forum | Wed Jun 01 23:09:46 EDT 2016 | slouis2014
Hi, can anybody give an idea how to lessen the void on a double ground pad IC. I have tried to change the stencil design, change the solder reflow setting. but i still haven't reach 75% solderability. thanks alot
Electronics Forum | Tue Apr 23 02:43:41 EDT 2019 | bukas
hello everyone, my ERSA has some sort of RAM error, error messages and suspected IC in pictures. did any of you come across something like this and does anyone know where/how to get new IC/motherboard? Thank you.
Electronics Forum | Sat Aug 10 10:29:38 EDT 2019 | jamestong
hi, guys, please help me-How to identify quality IC Shipping Tube? Thanks.
Electronics Forum | Mon Aug 12 10:39:05 EDT 2019 | jamestong
thank you, Relay I also find the answer to that questions as belows: https://www.sewate.com/how-to-identify-quality-ic-shipping-tube-guide/
Electronics Forum | Thu Jun 29 11:08:55 EDT 2000 | Dave F
Kok Han: Good to hear from you. Please help us understand you situation better by talking more about: � Component IC of the RF unit (IC101). For instance: SMT / PTH, package, pitch, lead material, lead finish, package type, package weight, coplan
Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark
| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
Electronics Forum | Tue Oct 17 01:42:34 EDT 2000 | Peter Carry
Dave, That's the funny thing, thru all that the output was pretty consistant with at least one bridge per board. * The ICs are going thru the wave in-line, according to IPC-782 figure 3-9, "Preferred IC Orientation". * Flatness of second wave is cont
Electronics Forum | Fri Sep 25 07:34:46 EDT 1998 | Dave F
| Anyone Knows a chamber(or something like this) to keep the IC's out of reach of humidity, information about where can I buy one I apreciate. | Thanks | AC Al: Check the following SMTNet Archive. Dave F Re: Drying ICs any advice Posted by
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
