Electronics Forum | Thu Aug 27 20:06:25 EDT 1998 | Kallol Chakraborty
Hi folks, Lately I am also having problem with BGA ball problem. We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could rework on CCGA but there is no certified process in industry as we speak
Electronics Forum | Sat Aug 29 09:12:39 EDT 1998 | Dave F
| Hi folks, | Lately I am also having problem with BGA ball problem. | We are finding more and more on X-ray analysis and is very expensive to replace. I know for sure that we could | rework on CCGA but there is no certified process in industry as w
Electronics Forum | Thu Aug 23 11:19:40 EDT 2001 | Hussman
Hi delnosa, Sorry about being 10 days late - don't get to the bottom of the page much. I'm working of layering flex circuits sandwiched between FR4 layers. The flex is primarily designed to take the place of interconnects like yours. I work in ap
Electronics Forum | Thu May 26 16:10:08 EDT 2005 | pjc
I have never seen a published "industry standard". What I've experienced with Fuji CP and IP is less than 1%. If feeders are changed over 3-4 times per day that will certainly add to this number. Not to mention sloppy operators. Some machines consume
Electronics Forum | Wed Nov 15 09:36:27 EST 2006 | Board House
Hi AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and L
Electronics Forum | Tue Jul 10 07:22:48 EDT 2007 | davef
Q1. Is kapton tape an industry accepted way of protecting gold pads from solder splashes? A1. No. It is more accepted to resolve the reason behind the solder splats, so that the added labor and cost of taping is eliminated. Search the fine SMTnet Arc
Electronics Forum | Mon Feb 25 08:14:04 EST 2008 | adetuc
Hi ... We use DRS24C Air-Vac machines for placing BGA devices, and have been having problems with shorts on corners of one device in particular, its a PBGA and its size is 4.5cm square and 15grams weight. When the component is picked up and the com
Electronics Forum | Wed Mar 11 17:51:22 EDT 2009 | GSx
Thank you so much Dave, by having different lots of PCB received (same Supllier) with suspected and good carbon ink deposit, I found useful to adopt a comparison test among the different lots by usingthe IPC-TM-650 2.4.1 Adhesion , Tape Testing (lik
Electronics Forum | Thu Jul 17 13:57:21 EDT 2008 | dphilbrick
The recommended bake temperature for components in Tape and Reel is 40C. If you use a bake temperature higher than that, the cover tape and other elements of the packaging will degrade to the point that it becomes impossible to reliably use an automa
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
