Electronics Forum | Tue Jun 25 07:12:46 EDT 2002 | Daan Terstegge
Because BGA's are so hard to rework, you'll want the maximum process window for your reflow equipment, and this includes an inert atmosphere. But as long as solderability and temperature profile are well controlled you can have perfect results with a
Electronics Forum | Mon Mar 19 10:54:22 EDT 2018 | robl
If you are doing double sided smt you need to look at a pin chain conveyor on your oven, not just a mesh belt. Regarding vapour phase I'm not an expert, but I've not seen one run with Nitrogen - as I understand it the vapour creates an inert atmosph
Electronics Forum | Fri Jul 16 22:49:55 EDT 1999 | Vic Lau
| We intend to use VOC free fluxe in our nytro machine. Does anybody know if there can be problems with water ie. solvent residues in the tunnel. Perhaps there are some white papers available on that issue. | | | | | Dear Raeto, In my experienc
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
Electronics Forum | Fri Jul 10 09:56:11 EDT 1998 | Justin Medernach
| I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. | Thanks for any and all help give
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee
The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen
Electronics Forum | Mon Mar 15 16:01:06 EST 1999 | Earl Moon
| Does anyone have any recommendations on spray fluxers? Are there major differences between the high priced ultrasonic machines to the low priced flux/air spraying machines? We are going to be spraying an OA flux with 11% solids content. Are there a
Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring
Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th
