Industry News | 2016-12-12 05:28:06.0
The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book online
Industry News | 2010-05-05 23:20:11.0
Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.
Electronics Forum | Fri Sep 21 10:35:37 EDT 2012 | davef
Flash gold is just thin electrolytic gold plating over electroless nickel or electrolytic nickel. Flash gold plating ... * Less than 3 microinch thick will be porous and take solder poorly * Greater than 10 microinch thick will cause brittle solder c
Electronics Forum | Mon Sep 24 10:07:46 EDT 2012 | eezday
The answer, as stated above, is 3 microinch's however, it is equaly important, if not more important, to understand that the only function of the gold is to protect the surfaces beneath it. Only enough gold to cover the nickel beneath it should be u
Electronics Forum | Wed Jul 12 11:46:00 EDT 2006 | flipit
Hi, One other note. You don't want gold to be more than 1% to 2% of the the solder joint. Above this percentage you will have embrittlemant issues. Lots of information on gold embrittlement on this site and on the Internet. I estimate your produ
Electronics Forum | Mon Dec 06 12:37:57 EST 1999 | Russ
Christopher, in response to your request concerning if I have the same issue using OA fluxes the answer would be no. This finish works well with all of our current Water Soluble fluxes. As a note, I have done some further testing and so far it see
Electronics Forum | Tue Dec 07 16:34:54 EST 1999 | Russ
Wolfgang, I appreciate your continued feedback! The main reason that I shortened the Time Above Liquidous (TAL) was it appeared that I was burning off all of the flux from the paste. By shortening the TAL to 45 seconds and decreasing peak temp to
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
