Electronics Forum | Mon Jan 15 21:54:19 EST 2007 | raychamp007
Dear Friend, Our SMT Production & component ware house RH currently control limit set to 40%RH - 60%RH, but not always achievable, the RH reading measurement are between 38%RH -65%RH. J-STD-001D recommend 30%RH - 70%RH. However it is only a recommen
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Thu Jul 31 23:07:55 EDT 2008 | davef
J-STD-006 lists maximum contamination levels for most solder alloys. This is the basis for purchasing solder. The SOLDER BATH contamination levels in J-STD-001 are based on decades of experience. But these contamination thresholds of various metals
Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum
Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a
Electronics Forum | Thu Mar 18 12:46:20 EDT 2010 | deanm
The standard J-STD-033B.1 addresses how to store moisture sensitive components. A dry box is a good, convenient way to store MSDs, but there are other methods to consider which are outlined in the standard. Are you sure that the problems are caused
Electronics Forum | Fri Feb 15 14:38:59 EST 2013 | bmario
Hi, We are having a problem with the interpretation of the surface evaluation criteria of J-STD-003 section 4.2.2.4.2. "A minimum of 95% of each of the surfaces (i.e. each pad) being tested shall exhibit good wetting. The balance of the surface may
Electronics Forum | Fri Aug 30 22:51:14 EDT 2013 | cvogel
IPC-J-STD-001E in regards to Ionic Cleanliness standards states less than 1.56 µg/cm² of total NaCL. Assuming a typical electronic process which involves smt, wave, and post-hand soldering and uses NO-Clean flux throughout all process, is it typi
Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef
Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori
Electronics Forum | Thu Sep 21 10:17:54 EDT 2017 | davef
I agree with you. IPC Committee 5-24b Solder Paste Task Group is responsible for maintaining J-STD-005, Requirements for Solder Pastes. They generate "standards, test methods, and a handbook that reflects current practices in all aspects of electro
