Electronics Forum | Mon Jun 21 15:11:38 EDT 1999 | JohnW
| | I am finding that some of our IC's are coming from the supplier with the humidity gauge in the bag reading 10-20%. Has anybody done any tests to determine what humidty level in a package will cause problems during reflow? | | Sound's to me li
Electronics Forum | Mon Jun 14 15:59:16 EDT 1999 | JohnW
| We are a medium sized PCB assy. house manufacturing about 2000 motherboards a day. There is a major problem we are facing at the wave soldering stage, i.e. warpage of the PCB. As soon as the PCB touches the wave it warps severely from the centre
Electronics Forum | Sun Jun 06 08:00:06 EDT 1999 | Dave F
snip | Ryan, | | The only advive I got is just don't do it!. Dave's right the grain growth in it is pretty bad. the other thing you got to look at is how much heat is the board gonna produce in it's working life..??? and where is it gonna be used,
Electronics Forum | Wed May 26 13:30:58 EDT 1999 | JohnW
| we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any obv
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW
| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar
Electronics Forum | Fri May 21 15:23:24 EDT 1999 | JohnW
| | Has anyone had any experience or data using vibration during the reflow process. | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process work
Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur
John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai
Electronics Forum | Fri May 07 15:37:22 EDT 1999 | JohnW
| This is not strictly a surface mount query but any input welcome | I am thinking of using surface mount solder thief pads for a through hole connector. The connector is two rows of 0.1" pitch pins and on waving there is often a bridge on the last t
Electronics Forum | Sun May 02 18:52:36 EDT 1999 | JohnW
| Tombstoning 0805s w/palladium/platinum/silver terminations | | We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... | | I�ve checked the reflow profile, and paste deposi
