Electronics Forum | Sat Mar 04 17:41:38 EST 2006 | samir
Wavemaster Larry must be new to the forum. What a nut! Sounds like a dude who needs to get his internet access taken away. In Riyadh, Larry, you'd get your arms sawed off for those comments! Grant is right. Hardware-wise, all thermal profilers
Electronics Forum | Mon Apr 09 19:50:33 EDT 2012 | action_101
Hello, We're building some boards with 01005's and the only issue we are running into is the solder is not reflowing. It's the damnest thing, we are having no issues with the printing process or placing the components, the two areas we thought we wo
Electronics Forum | Tue Jul 30 11:30:23 EDT 2002 | slthomas
We currently use the SuperMole and generally speaking it's a nice tool and gives us the information we need. The software could use some work, though. When you create a file for a new profile, you have to input a "time above" temperature for your
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Thu May 26 15:59:40 EDT 2005 | davef
Let�s not get drawn into making more of the amount of training required in order to be able to develop an effective reflow recipe than is necessary. A low-skilled operator with about one hour's training can setup the solder reflow oven. Consider co
Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL
Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi
Electronics Forum | Tue Feb 08 14:56:09 EST 2011 | rkr76
Hello everyone, I have a question regarding wavesoldering and measuring if a proces/machine is in control. I made a custom carrier for measuring contact time, parallelism, solder temperature, coveyorspeed and some data of the preheat section. The s
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