Electronics Forum | Wed Jan 01 21:58:31 EST 2014 | mysmt
Hi , Wish you a happy new year. Find attached datasheet of laminate. Thanks,
Electronics Forum | Thu Jan 02 23:39:33 EST 2014 | mysmt
Hi, FR1 laminiate used is only for single side type and THD plating is not used. I have also attached laminate manufaturer's datasheet. Thanks,
Electronics Forum | Mon Jan 06 17:37:54 EST 2014 | hegemon
Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moisture related since is so random. I would suggest perhaps 120C for a minimum of 8 hours to drive the moisture out, and then complete your wave soldering
Electronics Forum | Fri Aug 01 21:10:35 EDT 2008 | leo_dektec
You can keep only the 5th zone as the reflow zone. And lower the first two zones to keep a good ramping rate. Meanwhile,please note the ting temperature in software or control panel is not the exact temperature in your PCB, you'd better get a KIC or
Electronics Forum | Wed Jan 21 12:25:45 EST 2015 | dyoungquist
Kester makes a thermocouple solder: Alloy SN10PB88AG2 Flux "44" Core 58 Diam 0.031" I have used this to solder thermocouples to pcbs when profiling for lead-free temperatures. When done you can unsolder the thermocouple and reuse it again. This g
Electronics Forum | Mon Feb 06 22:45:59 EST 2006 | pyramus
Hi everybody! Just want to ask some recommendation if which epoxy is advisable to be used for bonding and underfill for BGA's at Lead Free Process. Currently, we only used Loctite 3515 for high temp curing for leaded process. How about for Lead fre
Electronics Forum | Tue Aug 09 10:02:07 EDT 2005 | davef
Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down) should be greater than 330*C for lead-free. Search the fine SMTnet Archives for more on Td.
Electronics Forum | Tue Feb 16 13:30:20 EST 2010 | asksmt
Hi, I have specified Lead Free Plating for my Four Layer PCB. but the Final Production Solder Process is not Lead free it is leaded Process. My question is will there be an issue if we use Lead free plating on PCB and use leaded solder material fo
Electronics Forum | Tue Feb 07 21:34:52 EST 2006 | davef
We agree that curing Loctite 3515 at lead-free temperatures is not a good idea. For lead-free, we know of some no-flow underfills, but no capillary flow underfills. Contact your underfill supplier for recommendations. When you have this conversati
Electronics Forum | Thu Sep 30 10:14:33 EDT 2004 | davef
USING CONDUCTIVE EPOXY: Epoxies do not bond well to tin or tin alloy surfaces. * For components: a silver-palladium or gold end termination is recommended. * For substrates: gold over nickel should work well. Remember epoxy is not hermetic, and ox
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