Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular su
Yamaha SMT Machines Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha SMT Machines Yamaha Z LEX YSM20R All-around Modular surface mounter -
Yamaha Z LEX YSM20R All-around Modular surface mounter Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R All-around Modular su
Yamaha SMT Machines Speed: 80,000 CPH Applicable Components: 0201 to 45×45 mm Size:L 1,374 x W 2,110 x H1,445mm Weight:2500KG Product description: Yamaha SMT Machines,high Speed Chip Mounter -Speed: 80,000 CPH,Applicable Components: 0201 to 45
Yamaha Z LEX YSM20R Pick and Place Machine Speed: 95,000 CPH Applicable Components 0201 to 45×45 mm Weight:2050KG Dimension:L 1,374×W 1,857×H 1,445 mm Product description: Yamaha Z LEX YSM20R Pick and Place Machine, Speed: 95,000 CPH, Applicab
Yamaha sigma-F8S surface Mounter Speed: 150,000 CPH Applicable PCB: L 330 x W 250 mm Weight:1,940KG Dimension: L 1,280 x W 2,240 x H 1,450 mm Product description: Yamaha sigma-F8S surface Mounter, Speed: 150,000 CPH, Applicable PCB: L 330 x W
Industry News | 2010-03-10 15:39:10.0
March 2010 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its new XPii SMT modular pick-and-place system, along with its award-winning iineo SMT platform in booth 1E03 at the upcoming NEPCON China/EMT China 2010 exhibition and conference scheduled to take place April 20-22, 2010 in Shanghai, PR China.
Industry News | 2010-03-24 13:35:52.0
APEX, NC - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will display its IINEO SMT platform, along with its new XPii-II pick-and-place unit in booth 2259 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
SFG Electronic Technology Co.,Limited Contact:Andy Tung Cell Phone/WhatsApp/Wechat:+86 13751093139 Skype:kelvin-andy Features that enable high productivity and stable quality Hybrid squeegee head Hybrid squeegee head, which has a good track rec
