New Equipment | Industrial Automation
Sales Manager: Sandy Lin Email: unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 yuehang: Shipping Term : TNT,DHL,FEDEX,ETC Payment Term : T/T Warranty: 12 month yuehang supply: New+original+factory sealed+high quality
Industry News | 2006-02-24 16:25:58.0
New MOSFET+Drivers Provide Operation up to 1 MHz and 3 % Better Efficiency Than Discrete Solutions
New Equipment | Industrial Automation
General Electric GIVEN YOUR BEST ! PLEASES mailto:unity@mvme.cn Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 General Electric Company is an Americanmultinati
Industry News | 2009-06-08 23:35:30.0
Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.
Technical Library | 2023-06-02 14:13:02.0
This work examines the use of dual-material fused filament fabrication for 3D printing electronic componentsand circuits with conductive thermoplastic filaments. The resistivity of traces printed fromconductive thermoplastic filaments made with carbon-black, graphene, and copper as conductive fillerswas found to be 12, 0.78, and 0.014 ohm cm, respectively, enabling the creation of resistors with valuesspanning 3 orders of magnitude. The carbon black and graphene filaments were brittle and fracturedeasily, but the copper-based filament could be bent at least 500 times with little change in its resistance.Impedance measurements made on the thermoplastic filaments demonstrate that the copper-based filamenthad an impedance similar to a copper PCB trace at frequencies greater than 1 MHz. Dual material3D printing was used to fabricate a variety of inductors and capacitors with properties that could bepredictably tuned by modifying either the geometry of the components, or the materials used to fabricatethe components. These resistors, capacitors, and inductors were combined to create a fully 3Dprinted high-pass filter with properties comparable to its conventional counterparts. The relatively lowimpedance of the copper-based filament enabled its use for 3D printing of a receiver coil for wirelesspower transfer. We also demonstrate the ability to embed and connect surface mounted components in3D printed objects with a low-cost ($1000 in parts), open source dual-material 3D printer. This work thusdemonstrates the potential for FFF 3D printing to create complex, three-dimensional circuits composedof either embedded or fully-printed electronic components.
Industry News | 2011-02-26 16:22:43.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth A04 at the upcoming BiTS™ Burn-In & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Industry News | 2011-03-07 14:43:24.0
Everett Charles Technologies' (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in its distributor, Tronic Electronics HK Ltd.'s, Booth 2452 Hall 2 at the upcoming Semicon China Exhibition. A new eight-page ZIP® Product Portfolio brochure will be available for the first time at the ECT CPG booth. ZIP® recently has been granted US Patent Number 7,862,391.
Industry News | 2012-06-11 18:32:49.0
Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore in Booth #6557 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Introduction: KD900, including of KD901, KD903, KD904, KD913, is produced to fix provisionally for the electronic manufacturing industry, in addition to the good positioning of the required viscosity, the most significant features of the anti-static