Electronics Forum | Tue Dec 17 13:56:43 EST 2019 | kylehunter
right, so for the main one, we will operate it in between it, and the tables against the wall. We plan on adding SPI/AOI to the main line, with the oven staying put, and the rest shifting downward. Question: 1) Landlord wants fewest holes in the r
Electronics Forum | Fri Aug 28 12:46:04 EDT 2020 | inspiredmorris20
Greetings all, my cp45 pnp machine is down this morning, gives me the code 0002 (front EME switch pressed). operator said they did not E-Stop, reset the unit and reboot the S/W a few times. the code pops up as soon as the software loads. I can turn
Electronics Forum | Sat Oct 07 12:15:03 EDT 2000 | fugtussey
PACE also makes a variety of repair kits called Thermobond Cir-Kit. You can find it at http://paceworldwide.com/MainBottom.asp?Page=ShowSystems.asp?ID=6
Electronics Forum | Mon Sep 18 14:53:24 EDT 2000 | Ricardo Fuentes
Hi, could someone tell me how may I certify or evaluate 0402 parts on SMT process, waht are the main points I have to check. Thanks
Electronics Forum | Sun Jun 25 22:58:49 EDT 2000 | gary
thanks for the feedback....but what's your delta T and how will you know that you are within the delta T range ?...I think this is the main point of the above topic...can you elaborate more on how did your company get Delta T ? thanks and regards,
Electronics Forum | Wed May 24 03:23:30 EDT 2000 | Dane Stokes
I would like to here some opinions from the industry on the DEK 265 models. All feed back positive or negative would be welcome. Main concerns are the Vortex and Proflow options are they worth the cost, or do they just add complications and extensive
Electronics Forum | Wed May 02 13:59:20 EDT 2001 | kt
Can anyone tell me what they think is the main cause of excessive solder at the end of the lead after wave. These are not solder peaks as if the leads were cold. It is a well wetted ball of solder on end of the lead. Also, some times you see excessiv
Electronics Forum | Thu Jul 05 07:34:57 EDT 2001 | steven
what is the main reasons that casuing solder ball during reflow? and how to remove them? (mostly arround the connector leads or between the 2 0402 chips). solder paste is RMA type. need advise. thanks
Electronics Forum | Fri Jul 06 04:02:28 EDT 2001 | eliishee
Thanks guys for all the input. i'm still struggling to find out the main cause. at time being, urgently need a suggestion of a effective way to remove all these solder balls. THANKS AGAIN.
Electronics Forum | Thu Jul 26 02:30:09 EDT 2001 | winnifred
Anyone tested or running 0201 chips?? T4 paste needed for this process? and what are the main factors to consider b4 going into it ?? Appreciate advice.
