Electronics Forum | Sat Jul 02 10:27:19 EDT 2022 | madisreivik
Hello ! I got exp only with leadfree HASL, but maybe the same problems apply. Also, the leaded HASL has probably lower process temperature. This could be copper, which has settled to the tank bottom. With leadfree, the copper is removed from molten
Electronics Forum | Thu Jan 08 16:16:09 EST 2004 | Dean
My first concern would be the choice of solder paste you have. There are better chemistries out there that far exceed the capabilities of the 609 2. Yes, the part will partially float on the solder (assuming plastic qfp). Cross sectioning would sho
Electronics Forum | Sun Aug 08 04:36:02 EDT 1999 | Brian
Dave Frankly, I think you may be barking up the wrong tree. Like DaveF, I suggest that the process would be horrendously expensive with masking and so on. The $64,000 question is whether what you propose will serve any useful purpose. I venture to
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
