New Equipment | Soldering - Other
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New Equipment | Solder Materials
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Yamaha YG12F pick and place machine SMD chip shooter with tray stacker for sale Product specification: 1.Model : YG12F 2.Object substrate :L50 * W50mm ~ L510 *W460mm (W360mm when assembling ATS15 / MT) " 3.Mounting accuracy:
New Equipment | Rework & Repair Equipment
Seamark Zhuomao full automatic rework equipment ZM-R6823 motherboard chip soldering and desoldering equipment Contact Rita Li by Whatsapp/Wechat/Viber:0086-134 3448 1030 Specification Power Supply AC 380V 50/60Hz Total Power
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Flason SMT Touch screen Manual stencil printing machine / solder paste printer pcb size: 1200mm*390mm Weight: 310KG Dimensions(L*W*H): 880*780*1630MM Voltage: 220V/50-60HZ Product description: Touch screen Manual stencil printing machine sold
Flason SMT Touch screen Manual stencil printing machine / solder paste printer pcb size: 1200mm*390mm Weight: 310KG Dimensions(L*W*H): 880*780*1630MM Voltage: 220V/50-60HZ Product description: Touch screen Manual stencil printing machine sold
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
