Electronics Forum | Thu Jan 05 15:42:26 EST 2006 | samir
Grant, The strength of the joint in a CCGA is the column for one...it's more ductile, made out of 90% Pb, and it's meant to compensate for the massive CTE mismatches between the ceramic and the board (ie the columns flex to relieve stress from the e
Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN
I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t
Electronics Forum | Sun Feb 18 16:47:34 EST 2007 | darby
As I stated, the reply was direct from Indium, (thanks to Rich Brooks). The information regarding cool down rates should come from your paste supplier; not an oven supplier; not a generic article on lead free. I just went through the data sheets from
Electronics Forum | Mon Mar 12 09:25:16 EDT 2007 | rgraves
Our internal designers are employing SMT connectors that utilize a �PCB positioning boss� in conjunction with normal gull wing leads. The use of these devices is based on the advertised ability of the boss to prevent �mis-insertions� and assist in �
Electronics Forum | Fri Jun 08 07:52:13 EDT 2007 | zanolli
We are looking at a specialized method of direct soldering ceramic circuit modules (maybe 40mm square) to a mother board with solder joints on only 2 of the 4 sides. These modules would be oriented horizontally, or mezzanine like, to the mother board
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Tue Sep 30 13:41:51 EDT 2014 | cyber_wolf
In 25 years of profiling, I have never seen a reflow profile make TOMBSTONES better. I have had "experts" come in an adjust our ovens to the "magic profile." The AOI data has never shown improvement from profile changes. EVER...EVER. As long as you
Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils
Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Fri Sep 17 06:01:12 EDT 1999 | Earl Moon
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
